New Delhi, India, January 20, 2016: STMicroelectronics has announced that it has ship edits 100 millionth chipset for digital cable and satellite set-top boxes (STB) in India.
“This key milestone highlights ST’s strong engagement in India and the competitiveness of our SoC portfolio that has been recently expanded with a new generation of innovative HD and Ultra-HD devices,” said Ted Grauch, Vice President Global Marketing, Consumer Product Division, STMicroelectronics.
ST’s products have set high standards in the Indian digital STB market for their quality, performance, high reliability, and total cost of ownership. With superbimage quality, ST solutions greatly improvethe end-user experiencefor linear and on-demandPay-TV services.
During Convergence India 2016, ST is demonstrating its latest STB products for HD (Liege3 SoCs) and Ultra-HD (Cannes/Monaco 4K SoC) markets.
Announced at IBC 2015, ST’s HD HEVC Liege3 chipsets deliver up to five times the performance compared with previous HD SoC generations and range from entry-level 3K DMIPS up to 6K DMIPS with embedded GPU. Raising the bar in entry and mid-range broadcast set-top boxes and Internet Protocol (IP) clients, the Liege3 SoC family is composed of satellite variants (STiH337/STiH332), cable-market products (STiH372), and IPTV set-top-box devices (STiH307/STiH302).
Bundle solutions are available on the Liege3 family for connected and Personal Video Recorder (PVR) STBs, significantly reducing the time required for an OEM to deliver an operator product.
Addressing the satellite markets, the STiH337/STiH332 SoCs implement a new DVB-S2X demodulation scheme enabling Service Operators to leverage compression-efficiency improvements brought by the HEVC technology. This results in the enhancement of S2X spectral efficiency for optimal use of the satellite transponder capacity.